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CY7C1049BNV33
512K x 8 Static RAM
Features
* High speed -- tAA = 12 ns * Low active power -- 504 mW (max.) * Low CMOS standby power (Commercial L version) -- 1.8 mW (max.) * 2.0V Data Retention (660 W at 2.0V retention) * Automatic power-down when deselected * TTL-compatible inputs and outputs * Easy memory expansion with CE and OE features
Functional Description[1]
The CY7C1049BNV33 is a high-performance CMOS Static RAM organized as 524,288 words by 8 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and three-state drivers. Writing to the device is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the eight I/O pins (I/O0 through I/O7) is then written into the location specified on the address pins (A0 through A18). Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the I/O pins. The eight input/output pins (I/O0 through I/O7) are placed in a high-impedance state when the device is deselected (CE HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE LOW, and WE LOW). The CY7C1049BNV33 is available in a standard 400-mil-wide 36-pin SOJ and 44-pin TSOPII packages with center power and ground (revolutionary) pinout.
Logic Block Diagram
Pin Configuration
SOJ Top View TSOP Top View
I/O0
INPUTBUFFER
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10
I/O1
ROW DECODER
I/O2
SENSE AMPS
512K x 8 ARRAY
I/O3 I/O4 I/O5
CE WE OE
COLUMN DECODER
A 11 A 12 A 13 A 14 A 15 A 16 A17 A18
POWER DOWN
I/O6 I/O7
A0 A1 A2 A3 A4 CE I/O0 I/O1 VCC GND I/O2 I/O3 WE A5 A6 A7 A8 A9
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
NC A18 A17 A16 A15 OE I/O7 I/O6 GND VCC I/O5 I/O4 A14 A13 A12 A11 A10 NC
NC NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
NC NC NC
A0 A1 A2 A3 A4 CE I/O0 I/O1 VCC VSS I/O2 I/O3 WE A5 A6 A7 A8 A9
NC NC
A18 A17 A16 A15 OE I/O7 I/O6 VSS VCC I/O5 I/O4 A14 A13 A12 A11 A10
NC NC NC
Cypress Semiconductor Corporation Document #: 001-06432 Rev. **
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised February 1, 2006
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CY7C1049BNV33
Selection Guide
-12 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum CMOS Standby Current (mA) Com'l Ind'l Com'l/Ind'l Com'l L 12 200 220 8 0.5 -15 15 180 200 8 0.5 -20 20 160 170 8 0.5
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................. -65C to +150C Ambient Temperature with Power Applied............................................. -55C to +125C Supply Voltage on VCC to Relative GND[2].....-0.5V to +4.6V DC Voltage Applied to Outputs[2] in High Z State .......................................-0.5V to VCC + 0.5V
DC Input Voltage[2] ................................ -0.5V to VCC + 0.5V Current into Outputs (LOW)......................................... 20 mA
Operating Range
Range Commercial Industrial Ambient Temperature 0C to +70C -40C to +85C VCC 3.3V 0.3V
DC Electrical Characteristics Over the Operating Range
-12 Parameter VOH VOL VIH VIL IIX IOZ ICC ISB1 Description Output HIGH Voltage Test Conditions VCC = Min., IOH = -4.0 mA Min. 2.4 0.4 2.2 VCC + 0.5 -0.5 GND < VI < VCC GND < VOUT < VCC, Output Disabled VCC = Max., f = fMAX = 1/tRC Max. VCC, CE > VIH VIN > VIH or VIN < VIL, f = fMAX Max. VCC, Com'l/Ind'l CE > VCC - 0.3V, Com'l L VIN > VCC - 0.3V, or VIN < 0.3V, f = 0 Com'l Ind'l -1 -1 0.8 +1 +1 200 220 30 2.2 -0.5 -1 -1 Max. Min. 2.4 0.4 VCC + 0.5 0.8 +1 +1 180 200 30 2.2 -0.5 -1 -1 -15 Max. Min. 2.4 0.4 VCC + 0.5 0.8 +1 +1 160 170 30 -20 Max. Unit V V V V A A mA mA mA
Output LOW Voltage VCC = Min., IOL = 8.0 mA Input HIGH Voltage Input LOW Voltage[2] Input Leakage Current Output Leakage Current VCC Operating Supply Current Automatic CE Power-Down Current --TTL Inputs Automatic CE Power-Down Current --CMOS Inputs
ISB2
8 0.5
8 0.5
8 0.5
mA mA
Capacitance[3]
Parameter CIN COUT Description Input Capacitance I/O Capacitance Test Conditions TA = 25C, f = 1 MHz, VCC = 3.3V Max. 8 8 Unit pF pF
Notes: 1. For guidelines on SRAM system design, please refer to the `System Design Guidelines' Cypress application note, available on the internet at www.cypress.com. 2. VIL (min.) = -2.0V for pulse durations of less than 20 ns. 3. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06432 Rev. **
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CY7C1049BNV33
AC Test Loads and Waveforms
3.3V OUTPUT 30 pF INCLUDING JIG AND SCOPE (a) R2 351 R1 317 THEVENIN EQUIVALENT 167 OUTPUT ALL INPUT PULSES 3.3V 90% 90% 10% Fall time: 1 V/ns GND RiseTime:1 V/ns 10%
1.73V
(b)
AC Switching Characteristics[4] Over the Operating Range
-12 Parameter Read Cycle tpower tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD Write Cycle tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE VCC (typical) to the First Access[5] Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to Low Z OE HIGH to High CE LOW to Low Z[6, 7] 3 6 0 12 12 10 10 0 0 10 7 0 3 6 15 12 12 0 0 12 8 0 3 7 0 15 20 13 13 0 0 13 9 0 3 8 Z[7] 0 6 3 7 0 20 3 12 6 0 7 3 8 1 12 12 3 15 7 0 8 1 15 15 3 20 8 1 20 20 s ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Description Min. Max. Min. -15 Max. Min. -20 Max. Unit
CE HIGH to High Z[6, 7] CE LOW to Power-Up CE HIGH to Power-Down
[8, 9]
Write Cycle Time CE LOW to Write End Address Set-Up to Write End Address Hold from Write End Address Set-Up to Write Start WE Pulse Width Data Set-Up to Write End Data Hold from Write End WE HIGH to Low Z[7] WE LOW to High Z
[6, 7]
Notes: 4. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 5. This part has a voltage regulator which steps down the voltage from 5V to 3.3V internally. T.power time has to be provided initially before a read/write operation is started. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured 500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. The internal write time of the memory is defined by the overlap of CE LOW, and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD. 10. No input may exceed VCC + 0.5V 11. .tr < 3 ns for the -12 and -15 speeds. tr < 5 ns for the -20 ns and slower speeds.
Document #: 001-06432 Rev. **
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CY7C1049BNV33
Data Retention Characteristics Over the Operating Range (For L version only)
Parameter VDR ICCDR tCDR[3] tR[11] Description VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time VCC = VDR = 2.0V, CE > VCC - 0.3V VIN > VCC - 0.3V or VIN < 0.3V Conditions[10] Min. 2.0 330 0 tRC Max Unit V A ns ns
Data Retention Waveform
DATA RETENTION MODE VCC CE 3.0V tCDR VDR > 2V 3.0V tR
Switching Waveforms
Read Cycle No. 1[12, 13]
tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID
Read Cycle No. 2 (OE Controlled)[13, 14]
ADDRESS tRC CE
tACE OE tDOE DATA OUT VCC SUPPLY CURRENT tLZOE HIGH IMPEDANCE tLZCE tPU 50% tHZOE tHZCE DATA VALID tPD 50% ISB ICC HIGH IMPEDANCE
Notes: 12. Device is continuously selected. OE, CE = VIL. 13. WE is HIGH for read cycle. 14. Address valid prior to or coincident with CE transition LOW.
Document #: 001-06432 Rev. **
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CY7C1049BNV33
Switching Waveforms (continued)
Write Cycle No. 1 (WE Controlled, OE HIGH During Write)[15, 16]
tWC ADDRESS tSCE CE tAW tSA WE tPWE tHA
OE tSD DATA I/O NOTE 17 tHZOE DATAIN VALID tHD
Write Cycle No. 2 (WE Controlled, OE LOW)[16]
tWC ADDRESS tSCE CE
tAW tSA WE tSD DATA I/O NOTE 17 tHZWE DATA VALID tPWE
tHA
tHD
tLZWE
Truth Table
CE H L L L OE X L X H WE X H L H I/O0 - I/O7 High Z Data Out Data In High Z Power-Down Read Write Selected, Outputs Disabled Mode Power Standby (ISB) Active (ICC) Active (ICC) Active (ICC)
Notes: 15. Data I/O is high-impedance if OE = VIH. 16. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 17. During this period the I/Os are in the output state and input signals should not be applied.
Document #: 001-06432 Rev. **
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CY7C1049BNV33
Ordering Information
Speed (ns) 12 Ordering Code CY7C1049BNV33-12ZC CY7C1049BNV33-12VXC CY7C1049BNV33-12VI CY7C1049BNV33-12VXI 15 CY7C1049BNV33-15VC CY7C1049BNV33-15VXC CY7C1049BNV33L-15VXC CY7C1049BNV33-15ZC CY7C1049BNV33-15VI CY7C1049BNV33-15VXI CY7C1049BNV33-15ZI 20 CY7C1049BNV33-20VC CY7C1049BNV33-20VXC CY7C1049BNV33-20VXI Package Name 51-85087 51-85090 51-85090 51-85090 51-85090 51-85090 51-85090 51-85087 51-85090 51-85090 51-85087 51-85090 51-85090 51-85090 Package Type 44-Pin TSOP II Z44 36-Lead (400-Mil) Molded SOJ (Pb-free) 36-Lead (400-Mil) Molded SOJ 36-Lead (400-Mil) Molded SOJ (Pb-free) 36-Lead (400-Mil) Molded SOJ 36-Lead (400-Mil) Molded SOJ (Pb-free) 36-Lead (400-Mil) Molded SOJ (Pb-free) 44-Pin TSOP II Z44 36-Lead (400-Mil) Molded SOJ 36-Lead (400-Mil) Molded SOJ (Pb-free) 44-Pin TSOP II Z44 36-Lead (400-Mil) Molded SOJ 36-Lead (400-Mil) Molded SOJ (Pb-free) 36-Lead (400-Mil) Molded SOJ (Pb-free) Industrial Commercial Industrial Commercial Industrial Operating Range Commercial
Please contact local sales representative regarding availability of these parts
\\
Package Diagrams
36-pin (400-Mil) Molded SOJ (51-85090)
51-85090-*B
Document #: 001-06432 Rev. **
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CY7C1049BNV33
Package Diagrams (continued)
44-Pin TSOP II Z44 (51-85087)
51-85087-*A
All product and company names mentioned in this document may be the trademarks of their respective holders.
Document #: 001-06432 Rev. **
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(c) Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C1049BNV33
Document History Page
Document Title: CY7C1049BNV33 512K x 8 Static RAM Document Number: 001-06432 REV. ** ECN NO. 423847 Issue Date See ECN Orig. of Change NXR New Data Sheet Description of Change
Document #: 001-06432 Rev. **
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